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Patent Searching and Data


Title:
CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2005093811
Kind Code:
A
Abstract:

To provide a large circuit board high in thermal conductivity and in rigidity, with design manhours for circuit arrangement decreased and with a manufacturing cost reduced.

The circuit board 100 comprises a metal board 3a which serves as a base, a flexible circuit board 1a bonded to the surface of the metal board 3a, and a printed circuit board 2a inserted into an opening 3ah formed in the metal board 3a arranged therein, and bonded to a part of the flexible circuit board 1a protruding into the opening 3ah. A connecting land 22 which is a part of a conductor pattern formed on the printed circuit board 2a and exposed on the surface of the printed circuit board 2a, and a connecting land 12 which is a part of a conductor pattern formed on the flexible circuit board 1a and exposed on the surface of the flexible circuit board 1a, are electrically connected to each other by a connecting member 4a.


Inventors:
NAKAKUKI KIYOSHI
Application Number:
JP2003000326509
Publication Date:
April 07, 2005
Filing Date:
September 18, 2003
Export Citation:
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Assignee:
DENSO CORP
International Classes:
H05K1/05; H05K1/02; H05K1/11; H05K1/14; H05K3/36; H05K3/46; H05K3/34; (IPC1-7): H05K1/11; H05K1/02; H05K1/05; H05K3/46
Attorney, Agent or Firm:
矢作 和行