Title:
回路基板
Document Type and Number:
Japanese Patent JP5241910
Kind Code:
B2
Abstract:
A circuit substrate for duplexers includes: a laminate substrate (22) in which a conductive layer and an insulating layer are laminated; a filter chip (10a) that has an acoustic wave filter and is provided inside of the laminate substrate (22); and an active component (16a) that is provided on a surface of the laminate substrate (22) and is connected with the filter chip (10a), at least a part of the active component (16a) overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.
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Inventors:
Sachiko Tanaka
Naoyuki Tasaka
Nishimura Goki
Naoyuki Tasaka
Nishimura Goki
Application Number:
JP2011282013A
Publication Date:
July 17, 2013
Filing Date:
December 22, 2011
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/25; H01P5/08; H01P11/00; H03H9/17; H03H9/54; H03H9/64; H04B1/40
Domestic Patent References:
| JP2007273585A | ||||
| JP2002359327A | ||||
| JP2002084070A | ||||
| JP2004282175A | ||||
| JP2001244638A | ||||
| JP2002344146A | ||||
| JP2001285024A |
Attorney, Agent or Firm:
Shuhei Katayama