Title:
CIRCUIT COMPONENT, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT ELEMENT
Document Type and Number:
Japanese Patent JP2007142287
Kind Code:
A
Abstract:
To provide a circuit component, a semiconductor device, a display device, and a method for manufacturing the circuit element by which element characteristics and reliability can be improved.
The circuit element includes a structure which is composed of an insulating film 5 and a conductive layer 6 stacked on a semiconductor layer 12. The angle of inclination θ in the vertical direction of an end intersecting with the conductive layer 6 when viewed from above of the semiconductor layer 12 is ≥45° and ≤70°.
Inventors:
NAKAZAWA ATSUSHI
MORI SHIGEYASU
MORI SHIGEYASU
Application Number:
JP2005336353A
Publication Date:
June 07, 2007
Filing Date:
November 21, 2005
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L29/786; H01L21/20
Attorney, Agent or Firm:
Yasuo Yasutomi
Takanori Tamai
Kazunobu Shigehira
Takanori Tamai
Kazunobu Shigehira