To provide a circuit connecting adhesive capable of enhancing connection reliability between a protruding electrode of an electronic component and a wiring electrode of a circuit board, when connecting the electronic component to the circuit board through the circuit connecting adhesive.

The protruding electrode 5 of the electronic component 3 is connected to the wiring electrode 4 of the circuit board 1 through the circuit connecting adhesive 2 having at least one kind of a thermosetting resin selected from an epoxy resin, a phenol resin, a polyurethane resin, an unsaturated polyester resin, and a urea resin and containing conductive particles and a silane coupling agent. The silane coupling agent contained in the circuit connecting adhesive 2 contains a silane coupling agent containing a mercapto group.

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