To provide a circuit connecting component enabling the circuit to connect for a certain time at a low temperature and an expansion of a base due to heat to be inhibited by compounding a conductive particle with an adhesive composition containing an oxetane compound.
A obtained circuit connecting component enables the circuit to connect for several ten sec to several hr at a temperature of 100-130°C. As an oxetane compound is preferable a compound having 1-4 of an oxetane ring in a molecule. An adhesive composition can contain a curing agent and a film- forming polymer other than the oxetane compound. As the curing agent is preferable an onium salt. As the film-forming polymer is cited a phenoxy resin, a vinyl copolymer, a polyamide, a polyether, a sulfone or the like. The compounding amount of the film-forming polymer is desirably 3-10,000 pts.wt. per 100 pts.wt. of the oxetane compound.
TAI SEIJI
MURAMATSU YUKIKO
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