Title:
CIRCUIT CONNECTING MATERIAL, FILM CIRCUIT CONNECTING MATERIAL, CIRCUIT CONNECTION SHEET, CIRCUIT CONNECTION BODY, AND CONNECTION METHOD OF CIRCUIT MEMBER
Document Type and Number:
Japanese Patent JP2013231097
Kind Code:
A
Abstract:
To provide a circuit connecting material that can obtain excellent adhesive strength and reliability under high-humidity/temperature even when performing connection of a circuit member that has an organic base material with low heat resistance such as polyethylene terephthalate, polycarbonate and polyethylene naphthalate at a low temperature.
A circuit connecting material 10 includes: (a) a thermoplastic resin; (b) at least two functional radically polymerizable compound; (c) mono functional radically polymerizable compound shown by general formula (1) or (2); (d) a radical polymerization initiator; and (e) a conductive particle 17.
Inventors:
YOKOTA HIROSHI
IZAWA HIROYUKI
ARIFUKU MASAHIRO
KUDO KEIKO
IZAWA HIROYUKI
ARIFUKU MASAHIRO
KUDO KEIKO
Application Number:
JP2012102492A
Publication Date:
November 14, 2013
Filing Date:
April 27, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J4/06; C08F2/44; C08F283/00; C08F290/06; C09J7/00; C09J7/02; C09J9/02; C09J11/04; C09J175/06; H01R11/01
Domestic Patent References:
| JP2012067281A | 2012-04-05 | |||
| JP2012041541A | 2012-03-01 | |||
| JP2011008052A | 2011-01-13 | |||
| JP2000239616A | 2000-09-05 | |||
| JPH11189763A | 1999-07-13 |
Foreign References:
| WO2011058999A1 | 2011-05-19 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Hideki Okita
Yoshinori Shimizu
Junichiro Sakamaki
Hideki Okita