To provide a circuit connection material for the electricity/electronics which is excellent in low-temperature fast curability and has a long pot life in the circuit connection material, a circuit terminal connection structure and a connection method.
An unisotropically conductive circuit connection adhesive-film-material adheres and fixes a semiconductor chip and a substrate by the face down system, and also connects electrically the electrodes of the both. The material has a two-layered structure and consists essentially of components as follows: (1) a curing agent which generates free radicals by heating, (2) a resin containing hydroxy groups of a molecular weight of 10,000 or more, (3) a radically polymerizable substance, and (4) conductive particles.
COPYRIGHT: (C)2006,JPO&NCIPI
Mitsugu Fujinawa
Yasuhiro Arifu
Tomoko Kanazawa
Atsushi Kuwano
| JP8111124A | ||||
| JP63081187A | ||||
| JP7090236A | ||||
| JP7073740A | ||||
| JP2004128465A | ||||
| JP10273630A | ||||
| JP10273626A |
| WO1998044067A1 |
Shiro Terasaki
Ryugo Akahori