Title:
CIRCUIT CONNECTION MATERIAL, MANUFACTURING METHOD THEREOF, AND METHOD OF MANUFACTURING JUNCTION BODY
Document Type and Number:
Japanese Patent JP2016181442
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit connection material or the like capable of increasing adhesive strength regardless of various options of cure system and material.SOLUTION: A circuit connection material includes: a peeling film; and an anisotropic conductive layer which is laminated on the peeling film and contains conducive particles. The peeling film has a plurality of through-holes in a thickness direction.SELECTED DRAWING: Figure 1
Inventors:
HATTORI MASAAKI
Application Number:
JP2015061655A
Publication Date:
October 13, 2016
Filing Date:
March 24, 2015
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
H01R11/01; H01B5/16; H01R43/00
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
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