Title:
CIRCUIT CONNECTION MATERIAL
Document Type and Number:
Japanese Patent JP2012219111
Kind Code:
A
Abstract:
To provide a circuit connection material which gives sufficient adhesion strength, even when a circuit member having a substrate formed from polyethylene terephthalate, polyethylene naphthalate or a polycarbonate, or a circuit member on whose surface a layer comprising a silicone resin, a polyimide resin, an acrylic resin or the like is formed is connected.
The circuit connection material for connecting a substrate and circuit members having circuit electrodes formed on the main surface of the substrate to each other comprises a curable resin composition curable by heating or photoirradiation, a polyether ester amide, and conductive particles.
Inventors:
NAKAZAWA TAKASHI
TAKEMURA KENZO
FUKUSHIMA NAOKI
TAKEMURA KENZO
FUKUSHIMA NAOKI
Application Number:
JP2011082913A
Publication Date:
November 12, 2012
Filing Date:
April 04, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J4/02; C09J9/02; C09J11/04; C09J171/00; C09J177/00; H01B1/22; H01R11/01; H05K1/14
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
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