Title:
CIRCUIT DEVICE HAVING GRAPHENE FILM AND METAL ELECTRODE BONDED ELECTRICALLY
Document Type and Number:
Japanese Patent JP2012138451
Kind Code:
A
Abstract:
To provide a circuit device in which a graphene film and a metal electrode are bonded well electrically by reducing the contact resistance between them while limiting the contact area (occupied area on a substrate) between the graphene film and metal electrode.
The circuit device utilizing a graphene film of single layer or multiple layers has a graphene film, a first metal electrode bonded directly to the graphene film, and a second metal electrode bonded directly to the graphene film. 90% or more of the graphene film in a region bonded to the first metal electrode, and 90% or more of the graphene film in a region bonded to the second metal electrode are heavily doped with p-type or n-type.
Inventors:
OKAI MAKOTO
HIROOKA MASAYUKI
WADA YASUO
HIROOKA MASAYUKI
WADA YASUO
Application Number:
JP2010289350A
Publication Date:
July 19, 2012
Filing Date:
December 27, 2010
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L29/786; C01B31/02; H01L21/336
Domestic Patent References:
| JP2006278586A | 2006-10-12 | |||
| JP2009277803A | 2009-11-26 | |||
| JP2010258246A | 2010-11-11 | |||
| JP2006272491A | 2006-10-12 | |||
| JP2010021377A | 2010-01-28 | |||
| JP2010153793A | 2010-07-08 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
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