Title:
回路装置
Document Type and Number:
Japanese Patent JP4330411
Kind Code:
B2
Abstract:
Provided is a circuit device having a structure for suppressing a leakage current between patterns. A circuit device of the embodiments has a constitution in which a circuit element and desired conductive patterns are integrally resin-molded. Furthermore, the circuit device includes: a first conductive pattern connected to a high impedance input terminal of the circuit element; a second conductive pattern provided close to the first conductive pattern; and a guard conductive pattern extended between the first and second conductive patterns. Accordingly, the circuit device is constituted to prevent a leakage current between the first and second conductive patterns.
Inventors:
Atsushi Kato
Atsushi Nakano
Atsushi Nakano
Application Number:
JP2003331636A
Publication Date:
September 16, 2009
Filing Date:
September 24, 2003
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L23/12; H01L21/60; H05K1/02; H01L23/48; H01L23/495; H01L23/66; H05K1/00; H05K1/18; H05K5/06
Domestic Patent References:
| JP8172248A | ||||
| JP2003078074A | ||||
| JP10098291A | ||||
| JP2003168759A | ||||
| JP2002261455A |
Attorney, Agent or Firm:
Takashi Okada
Katsuhiko Sudo
Katsuhiko Sudo