Title:
CIRCUIT MODULE AND ASSEMBLING METHOD FOR THE CIRCUIT MODULE
Document Type and Number:
Japanese Patent JP2001167936
Kind Code:
A
Abstract:
To provide a circuit module which can be assembled automatically.
A covering member, having a flat plate part and a support part is so equipped with a circuit board on which electronic parts are assembled, as the flat plate parts to become parallel by using the support part. When a circuit module is assembled on a mother circuit board, the slant of the flat plate part to an absorption nozzle can be made small, a sufficient absorption area can be maintained, and absorption transfer for the circuit module can be performed surely.
Inventors:
INOUE KEIJI
ISHIGE TSUTOMU
OTA YOSHITERU
ISHIGE TSUTOMU
OTA YOSHITERU
Application Number:
JP35353599A
Publication Date:
June 22, 2001
Filing Date:
December 13, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01F27/02; H02M3/28; H05K1/16; H05K1/18; H05K7/02; H05K1/14; H05K3/30; (IPC1-7): H01F27/02; H02M3/28; H05K1/18