Title:
回路パターン連続製造装置
Document Type and Number:
Japanese Patent JP7178749
Kind Code:
B2
Abstract:
Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.
More Like This:
Inventors:
Lee, Kyung Yuru
Choi, Kwang Jung
Sung Hoon, Hung Hyun
Choi, Woong
Choi, Kwang Jung
Sung Hoon, Hung Hyun
Choi, Woong
Application Number:
JP2021531027A
Publication Date:
November 28, 2022
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Samwon Act Company Limited
International Classes:
C25D7/06; C25D1/00; C25D1/04; C25D7/00; C25D17/00; H05K3/18
Domestic Patent References:
| JP48014506A | ||||
| JP2014062294A |
Attorney, Agent or Firm:
Ogura Patent Office