Title:
回路保護素子
Document Type and Number:
Japanese Patent JP5613790
Kind Code:
B2
Abstract:
The present invention relates to a circuit protection device and provides a circuit protection device comprising a laminate having a plurality of sheets laminated; a magnetic core provided within the laminate; a coil provided within the laminate and configured to wind vertically and to wrap the magnetic core; an ESD protection unit provided within the laminate and connected to the coil; first and second projecting electrodes connected to the coil and the ESD protection unit, respectively, and projected to be exposed to an outside of the laminate; and first and second external electrodes provided on the laminate and connected to the first and second projecting electrodes, respectively.
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Inventors:
パク，インギル
ノ，テヒョン
キム，ギョンテ
ナム，キジョン
キム，ヒョンシク
ノ，テヒョン
キム，ギョンテ
ナム，キジョン
キム，ヒョンシク
Application Number:
JP2013080877A
Publication Date:
October 29, 2014
Filing Date:
April 09, 2013
Export Citation:
Assignee:
イノチップ テクノロジー シーオー エルティディー
International Classes:
H01F27/00; H01C7/12; H01F17/00
Attorney, Agent or Firm:
Masayoshi Suda