Title:
CIRCUIT PROTECTIVE ELEMENT
Document Type and Number:
Japanese Patent JP3866366
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To avoid holding and fastening of a low melting point fusible alloy piece by a cured resin and make a circuit protective element thin by installing an insulating film between the fusible alloy piece coated with a flux and the cured resin layer.
SOLUTION: An opposed membrane electrode 2 is formed on an insulating base 1 and the tip end part of a lead wire 3 is made flat and connected to the membrane electrode 2. A low melting point fusible alloy piece 4 is connected between electrodes 2, 2 by welding and a flux layer 5 is formed on the alloy piece 4. An insulating film 6 is overlaid immediate on the flux layer 5 to completely cover the fusible alloy piece coated with the flux and reaches the peripheral part of the tip end of the lead wire. A cured resin layer 7 covers the insulating film 6 and the film 6 is firmly stuck to the resin layer 7. Consequently, the withstand strength to the internal pressure is improved by the film 6 firmly stuck to the resin layer 7, so that rupturing of the cured resin layer by an explosion due to the inner pressure increase by evaporation of the flux and scattering of the fusible alloy can be prevented even if the resin layer 7 is thin.
Inventors:
Uemura, Mitsuaki
Kawanishi, Toshiaki
Okamoto, Takashi
Kawanishi, Toshiaki
Okamoto, Takashi
Application Number:
JP1997000124662
Publication Date:
October 13, 2006
Filing Date:
April 03, 1997
Export Citation:
Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; H01H69/02; H01H37/00; H01H69/00; (IPC1-7): H01H37/76
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