Title:
半導体集積回路の回路シミュレーション方法及び半導体集積回路
Document Type and Number:
Japanese Patent JP6655306
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of performing circuit simulation of a semiconductor integrated circuit, which overcomes a problem of margin shortage among timing elements in the vicinity of a heat source element which generates heat that causes the problem.SOLUTION: A circuit simulation method includes steps of; producing a circuit diagram (201); simulating circuit operation (202); calculating amounts of heat generated by circuit elements using the simulation of circuit operation (203); making a floor plan of a circuit arrangement (205); calculating thermal resistance based on lead frame information and package information (206), (207); performing thermal simulation based on the calculated thermal resistance (208); calculating a maximum thermal gradient difference based on the thermal simulation (209); calculating worst timing based on the computed maximum thermal gradient difference (210); and performing circuit simulation with the worst timing (211).SELECTED DRAWING: Figure 5
Inventors:
Noboru Takizawa
Application Number:
JP2015127771A
Publication Date:
February 26, 2020
Filing Date:
June 25, 2015
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
G06F30/3312; G06F30/398; H01L21/82; H01L21/822; H01L27/04
Domestic Patent References:
| JP9266254A | ||||
| JP9282341A |
Foreign References:
| US20090199140 |
Attorney, Agent or Firm:
Sano patent office