Title:
CIRCUIT STRUCTURE, ELECTRIC CONNECTION BOX, AND MANUFACTURING METHOD OF CIRCUIT STRUCTURE
Document Type and Number:
Japanese Patent JP2015082890
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce the manufacturing costs of a circuit structure.SOLUTION: A circuit structure 12 includes: a circuit board 16 formed by forming a conducting path 17 at a dielectric plate 16A; a bus bar 20 overlapped with the circuit board 16; an electronic component 13 which is connected with at least one of the conducting path 17 of the circuit board 16 and the bus bar 20; bonding parts 23, each of which bonds predetermined ranges of overlapping surfaces of the circuit board 16 and the bus bar 20 with each other by bonding or adhesive joining; and fixing parts 25 which fix positions of the overlapping surfaces of the circuit board 16 and the bus bar 20, which are different from positions of the bonding parts 23, with solder.
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Inventors:
CHEN DENG
Application Number:
JP2013219322A
Publication Date:
April 27, 2015
Filing Date:
October 22, 2013
Export Citation:
Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H02G3/16; H05K7/06
Domestic Patent References:
| JPH1056244A | 1998-02-24 | |||
| JP2005304105A | 2005-10-27 | |||
| JP2003164039A | 2003-06-06 |
Attorney, Agent or Firm:
Akatsuki Joint Patent Office