Title:
Circuit structure
Document Type and Number:
Japanese Patent JP6222747
Kind Code:
B2
Abstract:
Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor.
Inventors:
Amano
Application Number:
JP2015166912A
Publication Date:
November 01, 2017
Filing Date:
August 26, 2015
Export Citation:
Assignee:
NEC Space Technologies, Ltd.
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| JP2003168903A | ||||
| JP11243281A | ||||
| JP2004087563A | ||||
| JP2001313505A | ||||
| JP2004259959A | ||||
| JP2006246189A |
Attorney, Agent or Firm:
Kenho Ikeda
Takashi Sasaki
Takashi Sasaki