Title:
CIRCUIT SUBSTRATE, WIRELESS COMMUNICATION DEVICE, AND FABRICATING METHOD FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2019083285
Kind Code:
A
Abstract:
To prevent, in a circuit board having conductor patterns on a main surface opposite to another main surface on which an electronic component is mounted, mounted failure of the electronic component while providing the conductor patterns highly densely.SOLUTION: A circuit board 12 comprises: a base board 26 having first and second main surfaces 26a, 26b opposite each other in a thickness direction; a conductor pattern 28 provided on the first main surface 26a of the base board 26; a plurality of electrode pads 44Aa, 44Ba provided on the second main surface 26b of the base board 26; and an electronic component 16 having a plurality of to-be-mounted electrodes 16a, 16b respectively connected opposite to the plurality of electrode pads 44Aa, 44Ba. The conductor pattern 28 has a portion overlapping a portion of the electronic component 16 so as not to overlap the plurality of to-be-mounted electrodes 16a, 16b, in a plan view of the base board 26.SELECTED DRAWING: Figure 11
Inventors:
DOI WATARU
EJIMA KAZUKI
YAMAGUCHI OSAMU
EJIMA KAZUKI
YAMAGUCHI OSAMU
Application Number:
JP2017211083A
Publication Date:
May 30, 2019
Filing Date:
October 31, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K1/02; H01F27/06; H01G2/06; H01L23/12; H01Q7/00; H05K1/18
Domestic Patent References:
| JP2012178611A | 2012-09-13 | |||
| JP2000151056A | 2000-05-30 | |||
| JP2007227622A | 2007-09-06 |
Attorney, Agent or Firm:
Samejima Mutsumi
Hiroshi Okabe
Hiroshi Okabe