Title:
CLAMP DEVICE
Document Type and Number:
Japanese Patent JPH05196848
Kind Code:
A
Abstract:
PURPOSE:To improve the wire strength and yield by bringing a wire connection part into contact with a mount surface (fixation surface and workbench surface). CONSTITUTION:This clamp device has the fixation surface 52 where a lead frame L/F is fixed, a fixation member 55 which fixes the lead frame L/F on the fixation surface 52, a positioning groove 51 for positioning an optical operating component E/O on the fixation surface 52, a holding member 53 which holds the optical operating component E/O positioned by the positioning groove 51, and a rotary mechanism 54 which presses the lead pin end part 103 of the optical operating component E/O against the fixation surface 52 by rotating the positioning groove 51 and holding member 53 in one body.
Inventors:
SHIODA AKIHIKO
GO HISAO
KAMAKURA MITSUTOSHI
GO HISAO
KAMAKURA MITSUTOSHI
Application Number:
JP950092A
Publication Date:
August 06, 1993
Filing Date:
January 22, 1992
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
G02B6/42; G02B7/00; (IPC1-7): G02B6/42; G02B7/00
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)