Title:
CLEANING APPARATUS
Document Type and Number:
Japanese Patent JPS6188530
Kind Code:
A
Abstract:
PURPOSE:To effectively eliminate contamination of fine pattern of wafer and contamination of organic substance by providing a mechanism for spraying cleaning liquid with an angle of 10-90 deg. for the wafer surface and a cleaning mechanism using ultraviolet ray. CONSTITUTION:A cover 6 is opened, a wafer 2 is placed on a board 3 within a vessel 1 and it is fixed with a pin 7. The board 2 is rotated at 100-1,000rpm, the cleaning liquid 11 is sprayed with the angle of 10-90 deg. to the wafer surface from a hole 10 of tube 8 and thereby contamination at the corner 2b of pattern 2d of wafer is perfectly eliminated. Next, under the reduced pressure condition, the board 3 is rotated at 800-1,000rpm and the wafer is dried and next an organic substance which is liably to remain on the pattern 2a of wafer can be eliminated by irradiating the wafer surface with ultraviolet ray lamp 9. Thus, the perfect cleaning of wafer 2 can be realized.
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Inventors:
MIYASHITA MORIYA
HIRATSUKA HACHIRO
HIRATSUKA HACHIRO
Application Number:
JP21091884A
Publication Date:
May 06, 1986
Filing Date:
October 08, 1984
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B08B3/02; H01L21/304; (IPC1-7): H01L21/304; B08B3/00
Attorney, Agent or Firm:
Takehiko Suzue
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