Title:
ラッピング装置の洗浄装置
Document Type and Number:
Japanese Patent JP7218731
Kind Code:
B2
Abstract:
The present invention provides a cleaning device for a device which comprises rotatable upper and lower surface plates and a slurry feeding nozzle and which laps a sandwiched workpiece by rotating the upper and lower surface plates while feeding a slurry. The cleaning device is formed on a surface plate bearer that supports the lower surface plate and that is rotatable therewith. The cleaning device, which cleans a waste liquid path for discharging waste slurry, comprises first and second cleaning nozzles that spray cleaning water, and an arm that fixes the positions and orientations of the first and second cleaning nozzles. The cleaning device is characterized in that, with respect to the waste liquid path comprising a ring-shaped portion positioned on the inner peripheral side of the surface plate bearer and a radial portion extending radially from the ring-shaped portion, the first cleaning nozzle is directed toward the ring-shaped portion, the second cleaning nozzle is directed from the inner peripheral side toward the outer periphery of the surface plate bearer, and automatic cleaning of the entirety of the waste liquid path is enabled by spraying the cleaning water while rotating the surface plate bearer. Thus, the cleaning device for the lapping device is capable of effectively removing sludge accumulated in the waste liquid path of the surface plate bearer, and performing automatic cleaning in a short period of time.
Inventors:
Suzuki Michio
Application Number:
JP2020002108A
Publication Date:
February 07, 2023
Filing Date:
January 09, 2020
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B55/06; B05B1/02; B24B37/08; H01L21/304
Domestic Patent References:
| JP201052090A | ||||
| JP2004281641A | ||||
| JP201664478A | ||||
| JP957610A | ||||
| JP3123555U |
Foreign References:
| KR101596598B1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi