洗浄装置、研磨装置

Japanese Patent JP7450385

B2

To provide a cleaning device capable of moving a cleaning member from a retracted position to a cleaning position, in which the footprint of a cleaning tank can be reduced.SOLUTION: A cleaning device 16 includes: a cleaning tank 41 defining a cleaning space where a wafer W is cleaned; a wafer rotation mechanism 42 arranged inside the cleaning tank 41 to hold and rotate the wafer; a cleaning member 43 rotatable around a central axis line that extends in a longitudinal direction, the cleaning member 43 contacting and cleaning the surface of the wafer; and a swing mechanism 44 swinging the cleaning member 43 around a swing axis line that is located inside the cleaning tank 41 and moving the cleaning member from a retracted position outside the wafer W to a cleaning position directly above the wafer W. The length of the cleaning member 43 is longer than the radius of the wafer W, and a distance from the center of the cleaning member 43 to the swing axis line is smaller than the diameter of the wafer W. The cleaning member 43 passes directly above the center of the wafer W when the swing mechanism 44 swings the cleaning member 43 around the swing axis line.SELECTED DRAWING: Figure 2

宮▲崎▼ 充
Takuya Inoue

JP2019236617A

March 15, 2024

December 26, 2019

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Ebara Corporation

H01L21/304; B08B1/32; B24B55/06

JP11238713A
JP2001007069A
JP2007529106A
JP2011181644A

US5775983

Seiji Ohno
Hideki Kobayashi
Hiroyuki Ohno
Koji Morita
Rika Fukami
Tomohiro Matsuno
Seiichi Sakatani
Hiroshi Nomoto

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