To provide a cleaning equipment capable of uniformizing a cleaned body such as a wafer and cleaning at high cleanliness.
This cleaning equipment has a spin chuck 9 by which a wafer W is allowed to rotate in a horizontal plane and a brush 10b brushing a surface of the wafer W at distal end, and comprises a brush arm 10a provided so as to pivot on proximal end in a horizontal plane, a rotation driver 22 supplying driving force to this brush arm 10a, a control device controlling this rotation driver 22. This control device sufficiently removes contaminant and prevents a cleaned surface form being contaminated by controlling the pivoting speed of the brush arm 10a to quickly pivot near the center of the wafer W with less adhered contaminant, while slowly pivoting near the circumference edge of the wafer W with greater adhered contaminant.
MIYAMOTO KENICHI
TANAKA HIDEYA
HIGUCHI RYOJI
