Title:
CLEANING METHOD OF SUBSTRATE
Document Type and Number:
Japanese Patent JPH08162438
Kind Code:
A
Abstract:
PURPOSE: To provide a cleaning method of a substrate wherein a compound layer which prevents wire bonding is eliminated, and damage to a chip can be avoided.
CONSTITUTION: In the cleaning method of a substrate, charged particles 14 between a first electrode 11 and a second electrode 12 facing the first electrode 11 to retain the substrate are accelerated and made to collide against the substrate, and the substrate is cleaned. An insulator mask 20 is arranged between the first electrode 11 and the second electrode 12, and the movement of the accelerated charged particles 14 is locally blocked.
Inventors:
HAJI HIROSHI
Application Number:
JP29837594A
Publication Date:
June 21, 1996
Filing Date:
December 01, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/302; H01L21/304; H01L21/3065; H01L21/60; H01L23/50; (IPC1-7): H01L21/3065; H01L21/304; H01L21/60
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Previous Patent: SIDE WALL FORMING METHOD OF SEMICONDUCTOR DEVICE
Next Patent: PLASMA ASHING EQUIPMENT
Next Patent: PLASMA ASHING EQUIPMENT