Title:
CLEAR MOLD SOLID IMAGE PICK-UP ELEMENT
Document Type and Number:
Japanese Patent JPH05114719
Kind Code:
A
Abstract:
PURPOSE: To accomplish a clear mold solid image pick-up element on which the defects such as irregularity, flaw and deterioration are not generated on the image not only on the manufacturing stage but also after shipment, and also reliability can be improved remarkably.
CONSTITUTION: A resin film 2 of acryl resin, polyimide resin and the like, having adhesive property against transparent resin 3, is provided in advance on the surface of the CCD chip 1 for the purpose of preventing the generation of mechanical damage on the surface of the CCD chip 1.
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Inventors:
NAKAI JUNICHI
NAKA SHUNICHI
NAKA SHUNICHI
Application Number:
JP27433591A
Publication Date:
May 07, 1993
Filing Date:
October 22, 1991
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L23/29; H01L23/31; H01L27/14; H04N5/335; H04N5/357; H04N5/372; (IPC1-7): H01L23/29; H01L23/31; H01L27/14; H04N5/335
Attorney, Agent or Firm:
Shusaku Yamamoto