To provide a clip for fixing a semiconductor element that prevents the semiconductor element from dropping off, as well as stabilizing the attitude of the clip used, when fixing the semiconductor element onto a heat-releasing plate.

A clip 1 for fixing a semiconductor element fixes a heat-releasing plate 6 and a semiconductor element, placed slightly apart from an edge 61 of the heat releasing plate 6, such that it pinches them between one end of an elastic plate material bent into approximately a gate shape and the other two-leg members 2 and 3, while forming a step 5, in contact with the edge 61 of the heat releasing plate 6 as well as preparing a hooking structure for hooking onto a concave portion formed on the surface of the semiconductor element.

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