Title:
CMP CONDITIONER AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008073825
Kind Code:
A
Abstract:
To provide a CMP conditioner having excellent corrosion resistance in the portions around abrasive grains.
A base body of an abrasive stone has an abrasive grain layer on one side surface thereof, the layer in which, abrasive grains are fixed in a metallic bond phase. A first protective layer composed of oxide is formed on the surface of the metallic bond phase in the abrasive grain layer by the sol-gel method. Next, a second protective layer composed of a thick oxide film is formed on the surface of the first protective layer by jetting aero-sol having fine powder of a brittle material distributed in gas and making the aero-sol collide with the surface of the first protective layer.
Inventors:
Yamashita, Tetsuji
Rikita, Naoki
Kimura, Takashi
Oku, Masaharu
Ashizawa, Hiroaki
Hatono, Hironori
Tokida, Masahiro
Rikita, Naoki
Kimura, Takashi
Oku, Masaharu
Ashizawa, Hiroaki
Hatono, Hironori
Tokida, Masahiro
Application Number:
JP2006000258894
Publication Date:
April 03, 2008
Filing Date:
September 25, 2006
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
TOTO LTD
TOTO LTD
International Classes:
B24B53/12; B24D3/00; H01L21/304
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