To provide a CMP conditioner capable of preventing a metallic element from eluding into slurry.

A number of tapered holes 14 are formed in a sheet 12 made of ceramic, corrosion-resistant resin, rolled material, or the like to accommodate diamond grains 16. The sheet 12 and the diamond grains 16 are stuck by adhesive 26 to be fixed in a state in which a part of each diamond grain 16 is protruded from an opening of the tapered hole 14. The diamond grains 16 are mechanically positioned in a number of the tapered holes 14 of the sheet 12, and, it is possible to prevent falling-off, and to use adhesive which does not include metal. Therefore, it is also possible to prevent scratches from occurring on a polished surface of a semiconductor wafer or the like polished by the CMP device. Moreover, it is possible to perform conditioning of a polishing pad for forming a high quality device in a stable state for a long period.