To reduce the influence on the disturbance of the flow of a polishing medium, at a gap between a pad and a wafer due to windowpane in a polishing pad for detecting a polishing end point.
A chemical mechanical polishing pad 200 includes a translucent windowpane 220 that allows optical measurements to be made using light energy reflected from the surface of a wafer 212 or other object being polished. The windowpane includes a trailing end and a leading end, each having a streamlined shape so as to reduce the disturbance to the flow of a polishing medium 216 around the windowpane. The polishing pad may further include grooves that are diverted around the windowpane so as to provide a continuous path for the polishing medium in the region of the windowpane.
Fumio Shinoda
Koshiro Tsukuda
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