Title:
CMUT TRANSDUCER AND METHOD FOR MANUFACTURING CMUT TRANSDUCER
Document Type and Number:
Japanese Patent JP2023172952
Kind Code:
A
Abstract:
To provide a method for manufacturing a Capacitive Micro-machined Ultrasound Transducer (CMUT).SOLUTION: A method for manufacturing a CMUT comprises steps of: forming a first silicon oxide layer 103 and a silicon nitride layer on a surface of a first silicon layer 101 which defines a first electrode of the CMUT; forming a silicon oxide wall 107 on the surface side of the first silicon layer by locally oxidizing silicon of the first silicon oxide layer and the silicon nitride layer; removing the silicon nitride layer; forming a second silicon oxide layer 111; forming a second silicon layer 113 on the second silicon oxide layer; thinning a substrate; forming an insulating groove 121 for the silicon oxide wall from a bottom surface of the substrate; and forming a metalization part 129 having an opening 127 directly above a region 123 of the substrate defined by the insulating groove in a lateral direction.SELECTED DRAWING: Figure 1I
Inventors:
KIM YOUNGIL
CYRIL MEYNIRE
DOMINIQUE GROSS
JACQUES HELLER
NICOLAS SENEGOND
CYRIL MEYNIRE
DOMINIQUE GROSS
JACQUES HELLER
NICOLAS SENEGOND
Application Number:
JP2023084777A
Publication Date:
December 06, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
VERMONT
International Classes:
H04R19/00; B81B3/00; B81C1/00; H04R31/00
Attorney, Agent or Firm:
Hidehito Kono
Norio Kawano
Norio Kawano