Title:
CO-EXTRUSION T DIE DEVICE
Document Type and Number:
Japanese Patent JP2015063105
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a co-extrusion T die device which allows temperature control of a multi-layer molten film immediately after discharge from the die for each resin layer by measuring a distribution in the die width direction (longitudinal direction) of temperatures of the individual resin layers of a multi-layer molten film discharged from the tip of a T die lip of a co-extrusion T die apparatus and feedbacks the temperature data to a resin extrusion machine and a heater provided in the T die so as to control temperature.SOLUTION: In a co-extrusion T die device, temperature control means 9 controls the temperatures of heaters 11-1a and 11-1b on the basis of temperature measurements obtained by temperature measurement means 8 so as to control the temperature in the width direction for each resin species of a multi-layer molten film R2.
Inventors:
YAMADA AKITSUGU
Application Number:
JP2013199645A
Publication Date:
April 09, 2015
Filing Date:
September 26, 2013
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B29C47/06; B29C47/78; B29C48/92