COAT LIQUID FOR FORMING FERROELECTRIC THIN FILM AND FERROELECTRIC THIN FILM FORMED BY USING THE SAME

Title:

COAT LIQUID FOR FORMING FERROELECTRIC THIN FILM AND FERROELECTRIC THIN FILM FORMED BY USING THE SAME

Document Type and Number:

Japanese Patent JP2003115484

Kind Code:

A

Abstract:

To obtain a coat solution for forming a ferroelectric thin film on a substrate, especially, forming a ferroelectric thin film having good hysteresis characteristics and saturation characteristics on a substrate of platinum, iridium, iridium oxide, etc.

The coat solution for forming the ferroelectric thin film contains an organic solvent (A) shown by the general formula R1R2C=O (1) shown below and an organic metal compound (B). (R1 and R2 are C1-C6 alkyl independent of each other).

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Inventors:

Ikeda, Norihiko
Shinoda, Tomohiko
Komatsu, Satoshi
Yamada, Kinji

Application Number:

JP2001000307280

Publication Date:

April 18, 2003

Filing Date:

October 03, 2001

Export Citation:

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Assignee:

JSR CORP

International Classes:

C01G35/00; C09D201/00; H01B3/12; H01L21/316; H01L21/8246; H01L27/105; H01L41/193; C01G35/00; C09D201/00; H01B3/12; H01L21/02; H01L21/70; H01L27/105; H01L41/18; (IPC1-7): H01L21/316; C01G35/00; C09D201/00; H01B3/12; H01L27/105; H01L41/193

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