Title:
被覆PSA顆粒
Document Type and Number:
Japanese Patent JP2014512427
Kind Code:
A
Abstract:
The hot melt pressure-sensitive adhesive (PSA) in the form of a granulate, the granulate comprises a core made of a hot melt pressure-sensitive adhesive and an outer layer, surrounding said core, made of a composition that is not pressure-sensitively adhesive, where the outer layer contains: 5 to 35 wt % of a hydrogenated styrene block copolymer; 20 to 65 wt % of at least one oil; and 0 to 15 wt % additives.
Inventors:
Geralt Petri
Eckhart Purkner
Steve Hatfield
Eckhart Purkner
Steve Hatfield
Application Number:
JP2013558359A
Publication Date:
May 22, 2014
Filing Date:
March 06, 2012
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J153/00; B29C48/05; B29C48/345; C08J3/12; C09J123/08; C09J125/08; C09J191/00; C09J191/06; B29C48/04
Domestic Patent References:
| JP2005199706A | 2005-07-28 | |||
| JP2004314516A | 2004-11-11 | |||
| JPH08281764A | 1996-10-29 | |||
| JP2006117361A | 2006-05-11 | |||
| JP2000198539A | 2000-07-18 | |||
| JP2006143263A | 2006-06-08 |
Foreign References:
| US6716527B1 | 2004-04-06 | |||
| WO2012016842A1 | 2012-02-09 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina