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Title:
COATED HEAT-EXPANDABLE MICROCAPSULE
Document Type and Number:
Japanese Patent JP2013234255
Kind Code:
A
Abstract:

To provide a coated heat-expandable microcapsule that maintains a high expansion ratio and can produce a foam-molded product where streaky flaws or white spot is less likely to occur; and to provide a method of producing the coated heat-expandable microcapsule.

A coated heat-expandable microcapsule comprises: a heat-expandable microcapsule formed such that a volatile inflating agent is included as a core agent in a shell consisting of a polymer; a silica that adheres to a surface of the shell; and a coating layer for coating the shell and the silica.


Inventors:
YAMAUCHI HIROSHI
Application Number:
JP2012106966A
Publication Date:
November 21, 2013
Filing Date:
May 08, 2012
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09K3/00; B01J13/14; B01J13/20
Attorney, Agent or Firm:
Atomi International Patent Office