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Title:
COATED MOLD EXCELLENT IN ADHESION RESISTANCE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2012136775
Kind Code:
A
Abstract:

To provide a coated mold excellent in adhesion resistance, and to provide a method for manufacturing the same.

The coated mold excellent in adhesion resistance has a surface coated with a hard coating film. The hard coating film includes: an (a) layer with which the mold base material side is coated and which is composed of any of Ti and a nitride, carbide and carbonitride of Ti; a (b) layer with which the mold surface side is coated and which is composed of a nitride of AlxCrySiz (wherein, x, y and z are each an atomic ratio, x+y+z=100, x>y, and 3≤z<20), and has a hardness of ≥35 GPa; and an intermediate layer that is arranged between the (a) layer and (b) layer and composed of a nitride of AlvCrw (wherein, v and w each represent an atomic ratio, and v>w) containing Ti whose ratio is reduced from the (a) layer side toward the (b) layer side and Si whose ratio is increased from the (a) layer side toward the (b) layer side so as to approach the Si ratio in the (b) layer. The coated mold excellent in adhesion resistance is characterized in that the hard coating film has a surface roughness of Ra of ≤0.1 μm and Rz of ≤0.8 μm, and when the hard coating film is pressed by using a Rockwell, the maximum size in exfoliation occurring in the radial direction from the outer periphery of an indentation is ≤50 μm.


Inventors:
SASAKI TOMOYA
ISHIKAWA TAKASHI
Application Number:
JP2011269966A
Publication Date:
July 19, 2012
Filing Date:
December 09, 2011
Export Citation:
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Assignee:
HITACHI TOOL ENG
HITACHI METALS LTD
International Classes:
C23C14/06; B21D37/01; B21D37/20; B21J13/02