Title:
実装回路板保護用コーティング剤、実装回路板における硫化防止方法、及び実装回路板
Document Type and Number:
Japanese Patent JP3975329
Kind Code:
B2
Abstract:
A coating composition is provided primarily comprising a (meth)acrylic resin containing hydrolyzable silyl and/or silanol groups, having a silicon atom content of 0.1-5 wt% and a weight average molecular weight of 1,500-30,000, and containing at least 50 mol% based on entire monomeric components of methyl methacrylate. The composition can be easily and reliably applied to substrates having metal portions on their surface, and after coating, can cure with air-borne moisture to form a uniform coat that maintains good electrically insulating properties and prevents the underlying metal portions from corrosion or sulfidation with sulfur compounds, and is thus suitable for the protection of packaging and interconnecting boards.
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Inventors:
Akinari Itagaki
Masaaki Yamatani
Masahiro Yoshizawa
Masaaki Yamatani
Masahiro Yoshizawa
Application Number:
JP2001381007A
Publication Date:
September 12, 2007
Filing Date:
December 14, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09D5/08; H05K3/28; C08F220/14; C09D133/06; C09D133/10; C09D133/12; C09D143/04
Domestic Patent References:
| JP8245903A | ||||
| JP7196975A | ||||
| JP7209503A | ||||
| JP60258274A | ||||
| JP7173435A | ||||
| JP6057198A |
Foreign References:
| WO1999062646A1 |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa