Title:
半導体素子保護膜用塗布組成物
Document Type and Number:
Japanese Patent JP5454780
Kind Code:
B2
Abstract:
Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.
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Inventors:
Kazuhiro Aoba
Application Number:
JP2009553421A
Publication Date:
March 26, 2014
Filing Date:
February 10, 2009
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
C09D129/04; C09D101/08; C09D139/06; H01L21/3065; H01L21/312
Domestic Patent References:
| JP2001323100A | 2001-11-20 | |||
| JP2003249471A | 2003-09-05 | |||
| JP2002088297A | 2002-03-27 | |||
| JPS52151560A | 1977-12-16 | |||
| JP2009040841A | 2009-02-26 | |||
| JP2005292329A | 2005-10-20 | |||
| JP2007328234A | 2007-12-20 |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
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