Title:
コーティング機器及びそのコーティング方法
Document Type and Number:
Japanese Patent JP7411093
Kind Code:
B2
Abstract:
A coating device comprises a chamber body having a reaction chamber, a support frame, a monomer release source and a plasma excitation source. The monomer release source has at least one release inlet for introducing a film forming material into the reaction chamber of the chamber body. The plasma excitation source is configured in the reaction chamber of the chamber body to excite the film forming material. The support frame is provided to support a substrate, the support frame being operatively moved within the reaction chamber to direct the substrate to alternately move closer to the monomer release source and the plasma excitation source, so as to prevent excessive decomposition of the film forming material.
Inventors:
Soken
Application Number:
JP2022537842A
Publication Date:
January 10, 2024
Filing Date:
June 09, 2020
Export Citation:
Assignee:
JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
International Classes:
C23C14/22; C23C14/12; C23C14/50; H01L21/683
Domestic Patent References:
| JP2009517852A |
Foreign References:
| WO2019020391A1 | ||||
| US20130045563 | ||||
| US20160002784 | ||||
| WO2016045858A1 |
Attorney, Agent or Firm:
Norito Yamao
Hiroshi Okabe
Kazuhisa Inaba
Satoshi Yoshimura
Hiroshi Okabe
Kazuhisa Inaba
Satoshi Yoshimura