To enhance the uniformity of the film thickness of obtained coating film when a coating liquid containing the component of a coating film and a solvent is helically delivered to apply the coating liquid onto the surface of a wafer W, i.e., a substrate and the solvent of the coating liquid is evaporated to form the coating film.
In the state that the wafer S is rotated around an approximately vertical axis by a wafer retaining part 42, while the coating liquid containing the component of the coating film and the solvent is delivered onto a surface of the wafer W by a coating nozzle 4, the coating nozzle 4 is gradually moved in the radial direction of the wafer W. The coating liquid is applied onto a first area of a coating film forming area of the wafer W by a coating nozzle 5 and the coating liquid is applied onto the front side of an advancement direction side of the nozzle 5 as compared with a delivering position of the coating liquid from the coating nozzle 5 at a second area on the outside of the first area while a solvent of the coating film is being sprayed by a spraying nozzle 54.
SUGIMOTO SHINICHI
KITANO TAKAHIRO
OKURA ATSUSHI
KURISHIMA KEISO
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