COATING FLUID FOR SILICA-BASED FILM FORMING AND METHOD FOR PRODUCING THE SAME

Japanese Patent JP3733824

B2

PROBLEM TO BE SOLVED: To obtain a coating fluid for silica-based film forming useful as a flattening film, an interlayer insulating film or the like used in a production of a semiconductor element and having low dielectric constant and to provide a method for efficiently producing the coating fluid.
SOLUTION: This coating fluid for silica-based film forming is composed of an organic solvent solution containing a basic hydrolytic condensation product of a polyalkoxysilane compound composed of a tetraalkoxysilane and an alkyltrialkoxysilane in an amount of 5-25 wt.% expressed in terms of SiO2 reduced concentration.

JP2021109888	PROPYLENE-BASED RESIN COMPOSITION AND MOLDING OF THE SAME
JP7127989	Antireflection material
WO/2021/235502	RESIN COMPOSITION, RUBBER COMPOSITION, RESIN MOLDED BODY, AND PRODUCTION METHOD FOR RESIN COMPOSITION

Eiji Hayashi
Koichi Hasegawa
Xu Eihide

JP2000051137A

January 11, 2006

February 28, 2000

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JSR CORPORATION

C08L83/04; H01L21/312; C08G77/06; C09D183/04; H01L21/316; (IPC1-7): C08L83/04; C08G77/06; C09D183/04; H01L21/312; H01L21/316

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