Title:
集積回路用途の被覆およびハードマスク組成物、これらの製造方法および使用
Document Type and Number:
Japanese Patent JP5674614
Kind Code:
B2
Abstract:
A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.
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Inventors:
ジヨーゼフ・ケネデイ
ウエイ・テイー・ホワン
キム・エヌ・ドウ
ジエイソン・スタツク
ウエイ・テイー・ホワン
キム・エヌ・ドウ
ジエイソン・スタツク
Application Number:
JP2011208839A
Publication Date:
February 25, 2015
Filing Date:
September 26, 2011
Export Citation:
Assignee:
ハネウエル・インターナシヨナル・インコーポレーテツド
International Classes:
H01L21/312; C08K3/22; C08K5/02; C08K5/16; H01L21/3065
Attorney, Agent or Firm:
In the patent business corporation Kawaguchi 國 case, it is a patent firm.