Title:
COATING METHOD WITH COPPER OR ALLOY THEREOF
Document Type and Number:
Japanese Patent JPH01152259
Kind Code:
A
Abstract:
PURPOSE:To efficiently form a thick film of a copper-based metal with high adhesion when a substrate is coated with the metal by a vacuum arc deposition method by specifying bias voltage impressed on the substrate. CONSTITUTION:A steel substrate 4 is fitted to a substrate holder 3 in the vacuum vessel 1 of a vacuum arc discharge type PVD device and the vessel 1 is evacuated to a prescribed degree of vacuum. Arc discharge is then caused with an arc power source 5 to melt and ionize a copper cathode 2 made of tough pitch copper and the resulting vapor is deposited on the substrate 4 to form a film. At this time, -10--150V bias voltage is impressed on the substrate 4 from a bias power source 6.
More Like This:
Inventors:
OKAMOTO KOJI
Application Number:
JP31156687A
Publication Date:
June 14, 1989
Filing Date:
December 09, 1987
Export Citation:
Assignee:
NISSIN ELECTRIC CO LTD
International Classes:
C23C14/24; C23C14/14; (IPC1-7): C23C14/14; C23C14/24
Domestic Patent References:
| JPS60255973A | 1985-12-17 | |||
| JPS62180064A | 1987-08-07 |
Attorney, Agent or Firm:
Miyai Akio