To provide a coating method capable of improving uniformity in film thickness while further improving solution saving without using dedicated facilities and achieving cost reduction of facilities and materials.

The coating method for dropping resist on a wafer 20 while rotating the wafer 20 and spreading the resist includes a stationary step of holding the wafer 20 on which the resist is not dropped in a stationary status, and an accelerated coating step of rotating the stationary wafer 20 while accelerating at a predetermined large acceleration until the wafer becomes a predetermined first rotation speed simultaneously at resist drop on to the wafer 20. The method further includes a constant speed rotation step of rotating the wafer 20 at the first rotation speed after the processing of the accelerated coating step.