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Title:
COATING PASTE
Document Type and Number:
Japanese Patent JP2007332267
Kind Code:
A
Abstract:

To provide a coating paste excellent in coatability and the dispersibility of inorganic powder or electrically conductive powder therein.

The coating paste is to be used in laminated-type electronic parts and characterized in containing 0.01-20 wt.% of organic microparticles 0.01-1μm in average size. Therefore, the coating paste is excellent in coatability and the dispersibility of inorganic powder or electrically conductive powder therein, enabling printing in high accuracy, furthermore, being usable as an electrically conductive paste by including electrically conductive powder therein, and since the electrically conductive paste is excellent in degreasing tendency after baking, enabling forming coating film of excellent electrical properties.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
ICHITANI MOTOKUNI
Application Number:
JP2006165452A
Publication Date:
December 27, 2007
Filing Date:
June 15, 2006
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09D17/00; H01B1/22; H01B3/00; H01G4/12; H01G4/30
Domestic Patent References:
JPH01253112A1989-10-09
JP2005191310A2005-07-14
JPH09186044A1997-07-15
JP2005302577A2005-10-27
JP2005298792A2005-10-27
JP2002371241A2002-12-26
JP2003213218A2003-07-30
JP2002255657A2002-09-11
JP2000345010A2000-12-12
JP2004134775A2004-04-30
Attorney, Agent or Firm:
Takuya Yamamoto