Title:
COATING REMOVING DEVICE FOR COATED WIRE
Document Type and Number:
Japanese Patent JPH05138386
Kind Code:
A
Abstract:
PURPOSE: To form plural parts where coatings of exact sizes for positioning are removed on a coated wire with the coating removing device for the coated wire to be used at the time of bonding the coated wire on a substrate.
CONSTITUTION: A mask 5 is arranged between a laser device 4 and the coated wire 30. Plural kinds of bored parts 6 are provided on the mask plate 5. The mask plate 5 is turned to so that the bored parts 6 can be moved within a range irradiated with a laser beam. The coated wire 30 is irradiated with the laser beam past the bored parts 6, by which the coatings are removed and the bare wire parts are formed.
Inventors:
YABUKI AKIHIKO
KOMORIYA HITOSHI
KATO HIDEO
OIKAWA KOICHI
KOMORIYA HITOSHI
KATO HIDEO
OIKAWA KOICHI
Application Number:
JP30797091A
Publication Date:
June 01, 1993
Filing Date:
November 22, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B23K26/352; B23K26/066; H02G1/12; H05K3/22; (IPC1-7): B23K26/00; B23K26/06; H02G1/12; H05K3/22
Attorney, Agent or Firm:
Tadahiko Ito (2 outside)