Title:
被膜剥離装置及び巻線装置
Document Type and Number:
Japanese Patent JP7385431
Kind Code:
B2
Abstract:
To solve the problem in which, in a conventional winding device, for example, when manufacturing a winding, there is a problem that an insulating coating of a conducting wire cannot be easily peeled off.SOLUTION: A coating peeling device 60 for peeling an insulating coating of a conducting wire L on a transport path includes a peeling tool 70 having a peeling blade 73 capable of contacting a surface of the conducting wire L for peeling the insulating coating of a contact portion and a displacement mechanism 62 for changing a position of the peeling tool 70 with respect to the conducting wire L in a transport direction of the conducting wire L. By the coating peeling device 60, the insulating coating of the conducting wire can be easily peeled off.SELECTED DRAWING: Figure 3
Inventors:
Takeshi Komatsubara
Hideaki Hyodo
Tadashi Takashima
Hiroki Hayashi
Yuta Takahashi
Hideaki Hyodo
Tadashi Takashima
Hiroki Hayashi
Yuta Takahashi
Application Number:
JP2019198698A
Publication Date:
November 22, 2023
Filing Date:
October 31, 2019
Export Citation:
Assignee:
Daihen Co., Ltd.
International Classes:
H02G1/12; B26D3/00; B26D5/08; B26D7/18
Domestic Patent References:
| JP632739Y2 | ||||
| JP11196513A | ||||
| JP53107951U | ||||
| JP4325813A | ||||
| JP2010183683A | ||||
| JP201290489A | ||||
| JP11332048A | ||||
| JP6471584A | ||||
| JP6029704A |
Attorney, Agent or Firm:
Hidekazu Tanikawa
Tsuyoshi Shiraka
Tsuyoshi Shiraka