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Title:
COIL ASSEMBLY FOR MAGNETIC RELAY
Document Type and Number:
Japanese Patent JPH07169622
Kind Code:
A
Abstract:

PURPOSE: To maintain high insulation property stably for a long period by suppressing the occurrence of the cracks of a cover for insulation while materializing the remarkable improvement of yield by enabling the injection molding and greatly lessening the breaking of a coil line at the time of injection molding.

CONSTITUTION: A cover 10 for insulation, which covers the periphery of the coil section 9 of a coil assembly 2, is made by the injection molding of thermoplastic rein such as LPC in which either fiber-shaped matter such as glass fibers, etc., or granular matter such as talc, etc., is mixed, and which is set to the melt viscosity of 200-500 poise under the condition of 250°C-340°C in molding temperature and 1000sec-1 in shearing speed.


Inventors:
HAYASE TETSUO
Application Number:
JP34316393A
Publication Date:
July 04, 1995
Filing Date:
December 14, 1993
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01F27/32; H01F7/06; (IPC1-7): H01F27/32; H01F7/06
Attorney, Agent or Firm:
Namba country



 
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