Title:
COIL SUBSTRATE AND MOTOR COIL SUBSTRATE
Document Type and Number:
Japanese Patent JP2022037328
Kind Code:
A
Abstract:
To provide a coil substrate having high efficiency.SOLUTION: A coil substrate 201 includes a flexible substrate 22 having one end 22 L and the other end 22 R, and a plurality of coils C11, C12, and C13 formed on the flexible substrate 22. The coils C11, C12, C13 are arranged almost in one row between one end 22 L and the other end 22 R, and the direction from the one end 22 L to the other end 22 R is a row direction, and each of the coils C11, C12, and C13 is formed by a wiring surrounding a central space SC and a central space SC, and the wiring forming the coils C11, C12, and C13 includes a wiring approximately parallel in the row direction (parallel wiring) and a wiring substantially perpendicular to the row direction (vertical wiring), and a thickness of the vertical wiring is thicker than a thickness of the parallel wiring.SELECTED DRAWING: Figure 2
Inventors:
MORITA HARUHIKO
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
Application Number:
JP2020141405A
Publication Date:
March 09, 2022
Filing Date:
August 25, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H02K3/26; H01F5/00; H05K1/02; H05K1/16
Attorney, Agent or Firm:
Akito Tagashita
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