Title:
COIL COMPONENT AND COIL MODULE
Document Type and Number:
Japanese Patent JP2023049131
Kind Code:
A
Abstract:
To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1
Inventors:
KAJIKIYA SHOMA
HIRAKI MAKOTO
MIYAO YOSUKE
HIRAKI MAKOTO
MIYAO YOSUKE
Application Number:
JP2021158690A
Publication Date:
April 10, 2023
Filing Date:
September 29, 2021
Export Citation:
Assignee:
TDK CORP
International Classes:
H01F17/00; H01F5/00; H01F17/04; H01F27/00
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese